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Mastery of leading-edge technology, rapid turnaround, and the capability to handle production runs of different sizes characterizes Elop’s electronic assembly process. We have accumulated and developed extensive expertise in all areas of sophisticated electronic assembly related to products and systems. We enjoy full in-house capabilities for electronic assembly and testing using sophisticated ATE (functional \ ICT) or other test equipment designed by company engineers. |  |
Extensive experience in the design, development, manufacture, assembly and testing of a wide variety of advanced electronic components and parts enables us to comply with stringent space and military standards, and to meet the objectives of even the most demanding commercial projects. A long list of successes in handling highly complex turnkey projects attests to this department’s skills. We are ISO 9001 and MIL-STD-2000 certified, we have ESA, IPC 610 and J-STD-001 conformance acceptance, and the approval of numerous armed forces and global corporations. Advanced PCB layout design and manufacturing systems and processes include: PCB layout design & Through Hole (TH), Surface Mount Technology (SMT), flexible/rigid circuits, In-Circuit Test (ICT) and functional test machines – as well as an emphasis on environmentally friendly cleaning processes. Stringent QA and timetable control procedures, incorporating advanced management systems, such as MBO, JIT and SPC, provide quality on time.
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