The electronics and signal/image processing are developed and manufactured at Elop employing cutting-edge FPGA technology. Detector sizes of the common module systems include 256 elements and the TDI scanning systems include 480 x 6 TDI while the FPA arrays include sizes of 320 x 256 pixels, 480 x 384 pixels and 640 x 512 pixels utilizing microscanning, which enables increased system resolution. Continuous zoom capabilities (1:20) are implemented in 8 to 12 mm systems and 1:30 zoom in 3 to 5 mm systems. The systems are cooled by a high-reliability linear close-cycle split Stirling cooler or rotary cooler.
Uncooled products are developed for mid-level performance systems such as helmet-mounted IR viewers, micro-UAV payloads, handheld thermal imagers and Enhanced Driving Systems. New technology development includes larger size FPAs (in conjunction with our SCD subsidiary), multi-spectral QWIP detectors enabling large arrays with superior image quality, wide-band optics, implementation of advanced Image Processing (IP) algorithms, and integrated laser detectors. Our expertise includes a superior level of system experience in modeling and simulating target features, emissivity, atmospheric effects, clutter, etc.
